About: http://webisa.webdatacommons.org/365570520

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	FIG. 1A is a cross-sectional side view through a wafer, illustrating a portion of a die having an integrated circuit formed thereon, and FIG. 1B is a view similar to FIG. 1A after an opening is formed in the wafer;
http://www.w3.org/ns/prov#wasQuotedFrom	google.com