About: http://webisa.webdatacommons.org/407008886

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The interconnect structure of claim 1 wherein said substrate is a semiconductor wafer having an adhesion promoter layer formed thereon.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com