| http://www.w3.org/ns/prov#value | - ] According to a fabricating method for fabricating an electronic device of the present invention, a plurality of functional devices such as surface acoustic wave devices or semiconductor devices can be mounted by a face-down bonding method (a technology for directly bonding a chip in an upside-down relation to a package without a step for die-bonding and wire-bonding) (for details of the face-dow
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