About: http://webisa.webdatacommons.org/6299846

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In addition, following the stacking process, the openings 36S (FIG. 7) between adjacent semiconductor substrates 12S-1, 12S-2 can be filled with a polymer material such as silicone, polyimide or an underfill polymer.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com