| http://www.w3.org/ns/prov#value | - BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a top plan view of a conventional packaged semiconductor device; FIG. 1B is an axial cross-sectional view of the package of FIG. 1A taken along the line IB-lB of FIG. 1A; FIG. 2A is a top plan view of another conventional packaged semiconductor dev
|
