| http://www.w3.org/ns/prov#value | - Today, solutions used in electronic applications, particularly in manufacturing ICs, contain simpler two-component additive packages (e.g., see Robert Mikkola and Linlin Chen, ???Investigation of the Roles of the Additive Components for Second Generation Copper Electroplating Chemistries used for Advanced Interconnect Metallization,??? Proceedings of the International Interconnect Technology Confe
|
