| http://www.w3.org/ns/prov#value | - In more detail, the wafer 1 is grounded by means of the ground electrode and plasma, then a high voltage of e.g. 2 kv is applied to the conductive sheet 44, and a coulombic force is exerted between the wafer 1 and sheet 44, whereby the wafer 1 is electrostatically held by the holding sheet 22.
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