About: http://webisa.webdatacommons.org/131840293

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention provides a method of manufacturing a semiconductor package and such a package as described in the accompanying claims.
http://www.w3.org/ns/prov#wasQuotedFrom	docstoc.com