| http://www.w3.org/ns/prov#value | - FIG. 1A is a top view, FIG. 11B is a sectional view along line A-A of FIG. 11A, and FIG. 11C is an enlarged view of FIG. 11B. [0075] Subsequent to the steps mentioned above, the package substrate 2 is bonded to the printed board 4 with the bump 102 therebetween.
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