| http://www.w3.org/ns/prov#value | - It is noted here that it is preferable to form, not shown in the figure, an insulating film (a barrier insulating film) with a property as a barrier for preventing diffusion of copper included in the second conductive film after forming the wiring including copper shown in FIG. 1E. For the barrier insulating film, a material such as silicon nitride, silicon oxynitride, aluminum nitride, aluminum o
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