| http://www.w3.org/ns/prov#value | - Still other prior art devices have achieved high performance by employing unusually expensive materials, subcomponents, or processes in their own construction. [0036] For example, one prior art approach that has been used to overcome these limitations uses hermetic semiconductor packaging, hybrid chip-on-board techniques, exotic materials such as ceramics, KOVAR and glass, or complex assemblies in
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