| http://www.w3.org/ns/prov#value | - It is, therefore, an object of the present invention to provide a method and structure for substantially reducing or eliminating the wettability of metal surfaces, particularly noble metal surfaces, and specifically gold or other noble metal surfaces, to organic materials, particularly any components of an adhesive, such as an epoxy used for attaching an I/C chip to a substrate, and which I/C chip
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