| http://www.w3.org/ns/prov#value | - package including a non-planar heat spreader and method of making the sameUS7724527Aug 25, 2008May 25, 2010International Business Machines CorporationMethod and structure to improve thermal dissipation from semiconductor devicesUS7888790 *Sep 23, 2008Feb 15, 2011Intel CorporationBare die package with displacement constraintUS7965514Jun 5, 2009Jun 21, 2011Laird Technologies, Inc.Assemblies and met
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