| http://www.w3.org/ns/prov#value | - In addition, with or without burn-in or other testing, it is desirable to have a method of bonding a semiconductor integrated circuit device or alternatively a laser device to a heat-sinking or heat-spreading element (submount) and, if desired, subsequently being able to remove the device from the submount, as for the purpose of reusing the submount for supporting another device, or in the alterna
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