| http://www.w3.org/ns/prov#value | - The passivation layer 18 may be silicon dioxide, silicon nitride, a polyimide, or other material suitable for protecting the integrated circuits 14. [0024] Referring now to FIG. 2, the bond pads 16 are typically polygonal (e.g., square) metal pads, about 100 microns on a side.
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