About: http://webisa.webdatacommons.org/293552891

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In BGA and FBGA packaging techniques, a fabricated semiconductor die such as a dynamic random-access memory chip is adhered by tape or other adhesive to a surface of a printed circuit board (PCB) or other substrate.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com