| http://www.w3.org/ns/prov#value | - The present embodiment is an embodiment in which each substrate is formed by an InP substrate attached to a silicon substrate by way of achieving a hybrid structure in which a CMOS-LSI circuit is formed on a silicon substrate and light receiving elements as well as the light emitting elements are formed on the InP substrate while signal transmission between the substrates is effected by light tran
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