| http://www.w3.org/ns/prov#value | - The contact pads and traces may be at least partially covered by a dielectric material, such as a polyimide or other suitable material known in the art.In a preferred embodiment, the size of the die employing a standardized external connection (I/O) array can be reduced at least twice for a given integrated circuit device, one such exemplary device being a sixty-four megabit dynamic randomaccess m
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