About: http://webisa.webdatacommons.org/32788091

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Accordingly, there is a need for an improved package for a semiconductor die that provides improved rigidity without the use of external supports and further provides the capability to mount the die with a vertical orientation.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com