| http://www.w3.org/ns/prov#value | - First, as shown in FIG. 13A, a via hole 22 b is formed of a predetermined pattern through a first inter level dielectric (lower-layer inter level dielectric of an n-th layer) 21 a of the n-th layer along a thickness direction in such a manner as to expose the surface of a lower-layer Cu wire 3 by a method similar to that of the first embodiment.
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