| http://www.w3.org/ns/prov#value | - 1530Jan 27, 2005Jul 4, 2006International Business Machines CorporationMultiple layer structure for substrate noise isolationUS8067819 *Nov 22, 2006Nov 29, 2011Ricoh Company, Ltd.Semiconductor wafer including semiconductor chips divided by scribe line and process-monitor electrode pads formed on scribe line* Cited by examinerClassifications U.S. Classification438/705, 257/E21.335, 257/E21.573Intern
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