| http://www.w3.org/ns/prov#value | - This takes place by liquefying solder 18 that is impressed onto conductor surface elements 17, in the reflow oven, and, as a result of the surface tension of the solder on surface pieces 17, solder humps or solder caps of a defined size are formed, whose shape is a function only of the size of the conductor surface elements 17 and of the quantity of solder that is impressed.
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