| http://www.w3.org/ns/prov#value | - A manufacturing method of a semiconductor device comprising the following steps: a first step of forming a layer to be peeled including TFT on a first substrate; a second step of applying a film containing organic resin which dissolves to solvent on the layer to be peeled; a third step of adhering a second substrate on the film containing the organic resin with a first double-stick tape, and sandw
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