| http://www.w3.org/ns/prov#value | - Although the improved stack of FIG. 4 can be obtained by various techniques such as sputtering and evaporation, use of electro-deposition to form this stack is favored because electro-deposition can be carried out cold and therefore Ga can be kept solid as the In film is deposited over it by electroplating and the Ga/In interface can be kept abrupt during deposition without much intermixing.
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