About: http://webisa.webdatacommons.org/42277586

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Subsequently, a planarization process such as Chemical Mechanical Polishing (CMP) or etchback is performed to expose a top surface of the lower insulating pattern 121, thereby forming a structure as illustrated in FIG. 4 f.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com