| http://www.w3.org/ns/prov#value | - A manufacture method of a flexible multilayer wiring board according to claim 1, wherein by repeating said laminating, second forming and third forming n times wherein n is an integer equal to or greater than two, formation of the first to (n+1)th layer circuit wirings and interlayer connection therebetween are performed, and said removing is applied to said (n+1)th layer circuit wiring.
|
