PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • After landing pad material 220 has been deposited, sacrificial layer 202 is removed to release device 230 as shown in FIG. 2E. Sacrificial layer 202 may be removed by any suitable method, such as wet etch or other isotropic etch process.
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