Head noun: leadframe
| Same concepts |
|---|
Broader concepts
| label | provenance | confidence |
|---|---|---|
| electronic device | isap:135615246 | 0.404944 |
| semiconductor device | isap:135615245 | 0.398155 |
| electronic component | isap:351577802 | 0.339710 |
| substrate | isap:351437093 | 0.232791 |
| carrier | isap:27279299 | 0.215527 |
| type | isap:149391683 | 0.197816 |
| leadframe | isap:353195541 | 0.185748 |
| material | isap:410982151 | 0.183826 |
| package | isap:24779679 | 0.156708 |
| die | isap:487883413 | 0.125469 |
| semiconductor | isap:507262497 | 0.098301 |
| invention | isap:352601515 | 0.072189 |
Narrower concepts
| label | provenance | confidence |
|---|---|---|
| loc leadframe | isap:353195544 | 0.589345 |
| die pad | isap:261923524 | 0.453942 |
| injection molding | isap:317696308 | 0.451780 |
| leadframe 10 | isap:353195545 | 0.367285 |
| corner | isap:422410443 | 0.231762 |
| die | isap:262790984 | 0.195785 |
| leadframe | isap:353195541 | 0.185748 |
| lead | isap:290875296 | 0.144439 |
| substrate | isap:351453924 | 0.133750 |
| method | isap:420049479 | 0.062979 |