Premodifier: ball grid arrayHead noun: bga
Same concepts |
---|
Broader concepts
label | provenance | confidence |
---|---|---|
component | isap:261997335 | 0.739530 |
technique | isap:263389960 | 0.654825 |
package | isap:236793863 | 0.634703 |
packaging method | isap:211677085 | 0.600086 |
type of semiconductor package | isap:248252045 | 0.579526 |
semiconductor chip | isap:250009247 | 0.558801 |
interconnect | isap:241386742 | 0.554500 |
integrate circuit package | isap:236793865 | 0.554267 |
type of integrate circuit | isap:248252044 | 0.552919 |
semiconductor package | isap:236793867 | 0.539992 |
surface | isap:235817893 | 0.522332 |
structure | isap:263712476 | 0.483245 |
additionally | isap:241465037 | 0.439320 |
example | isap:235361944 | 0.416679 |
device | isap:213226688 | 0.399718 |
Narrower concepts
label | provenance | confidence |
---|---|---|
package | isap:508577278 | 0.369324 |
surface | isap:509848759 | 0.363294 |