Premodifier: semiconductorHead noun: package
| Same concepts |
|---|
| http://dbpedia.org/resource/Semiconductor_package |
Broader concepts
| label | provenance | confidence |
|---|---|---|
| semiconductor device | isap:276399274 | 0.887702 |
| electronic component | isap:320474273 | 0.871738 |
| print circuit board | isap:34958917 | 0.797153 |
| electronic device | isap:276399279 | 0.768231 |
| semiconductor chip | isap:78434289 | 0.725161 |
| semiconductor package | isap:433286415 | 0.599864 |
| device | isap:276399306 | 0.511400 |
| method | isap:274152236 | 0.449678 |
| system | isap:270840094 | 0.362894 |
| semiconductor | isap:145658202 | 0.286615 |
| lead frame | isap:35365477 | 0.279170 |
| same | isap:72040269 | 0.272606 |
| package | isap:433286672 | 0.256365 |
Narrower concepts
| label | provenance | confidence |
|---|---|---|
| pin grid array package | isap:433286525 | 0.807473 |
| semiconductor element | isap:437500443 | 0.694651 |
| chip scale package | isap:433286437 | 0.656024 |
| semiconductor chip | isap:5798795 | 0.642021 |
| semiconductor package | isap:433286415 | 0.599864 |
| print circuit board | isap:230105336 | 0.578974 |
| circuit board | isap:230105334 | 0.576801 |
| semiconductor device | isap:449790687 | 0.562900 |
| ball grid array bga | isap:236793867 | 0.539992 |
| manufacturing method | isap:440814975 | 0.530926 |
| lead frame | isap:226968016 | 0.500490 |
| capacitor | isap:25405756 | 0.430261 |
| die | isap:235599926 | 0.400468 |
| bga | isap:236793864 | 0.374773 |
| package | isap:433286434 | 0.348883 |
| csp | isap:233572190 | 0.338531 |
| heat | isap:7355173 | 0.327845 |
| part | isap:8011927 | 0.300427 |
| substrate | isap:27573763 | 0.300356 |
| fig 4 | isap:232347048 | 0.266627 |
| lead | isap:9709554 | 0.232534 |
| same | isap:11718930 | 0.215368 |
| chip | isap:5798804 | 0.195609 |
| method | isap:440814967 | 0.186863 |
| apparatus | isap:28103026 | 0.174162 |
| surface | isap:437445666 | 0.144783 |
| therefore | isap:27733078 | 0.142138 |