Premodifier: print circuit
Head noun: board

Same concepts

Broader concepts

labelprovenanceconfidence
electronic circuitryisap:3356058130.863744
electrical deviceisap:1598916540.863452
electronic assemblyisap:2941404730.860210
applicationisap:2074503900.856829
electrical circuitisap:2225441630.832368
productisap:2311450010.830918
itemisap:1958473220.815504
electronic substrateisap:3348130310.812409
electrical componentisap:3386278280.810479
wide variety of applicationisap:2243878690.809414
next level of interconnectionisap:3649082630.806871
patent searchpatentsa deviceisap:1598917380.800444
electronic circuit assemblyisap:2941404760.798163
sensitive electrical equipmentisap:3349913940.792114
electronic equipmentisap:3349913910.788823
print circuit boardisap:3734140600.779234
other electrical componentisap:3386278780.777575
electronic deviceisap:1598916510.774611
electrical apparatusisap:3381374290.771584
electrical substrateisap:3348130170.766311
electronic circuitisap:2225441580.766155
circuit boardisap:3734140430.755200
higher level packagingisap:3379784840.751915
computer componentisap:3386279370.749219
second level packageisap:2301053330.747976
componentisap:3386278220.743303
circuitisap:2225441550.741752
external circuitisap:2225441570.741253
electronic elementisap:2305962400.740035
electrical equipmentisap:3349914030.739762
interconnection substrateisap:3348130240.738806
type of electronic componentisap:1952358280.737704
electronic systemisap:1607771020.736019
organic substrateisap:3348130700.732305
circuitize substrateisap:3348130300.732297
circuit substrateisap:3348130150.731624
wireless untethered deviceisap:1598917340.730404
electrical circuitryisap:3356058160.730309
external circuitryisap:3356058080.724591
packaging substrateisap:3348130340.723649
support structureisap:3373343170.720410
circuit panelisap:3766207360.718693
support substrateisap:3348130530.718552
substrate materialisap:2976785500.716778
user substrateisap:3348130960.714505
microelectronic deviceisap:1598916850.712882
carrier substrateisap:3348130060.712474
integrate circuitisap:2225441560.710292
system componentisap:3386279220.708150
conductive materialisap:2976785580.707419
internal componentisap:3386278630.705869
similar deviceisap:1598917360.703653
conventional substrateisap:3348130920.703399
print circuit substrateisap:3348130640.702162
electronic moduleisap:1607033680.701595
multi-layer substrateisap:3348130500.696265
type of circuit substrateisap:1952358520.695925
other componentisap:3386278540.695271
dielectric materialisap:2976785510.692001
rigid substrateisap:3348130230.690363
external deviceisap:1598916530.687320
various fieldisap:3733052340.685350
non-conductive substrateisap:3348131170.684783
flexible substrateisap:3348131300.682874
support memberisap:1634909060.680930
flat surfaceisap:2281793490.680514
rigid supportisap:2296109190.675833
electronic productisap:2311450150.672442
work pieceisap:3758469740.670607
deviceisap:1598916490.669511
semiconductor substrateisap:3348130510.655931
type of substrateisap:1952358270.645672
plateisap:3649071210.644616
boardisap:3734140450.644570
semiconductor deviceisap:1598916840.641232
certain componentisap:3386278560.640413
circuitryisap:3356058100.637768
materialisap:2976785080.635681
variety of applicationisap:2243878780.634275
level of packagingisap:3649082640.633825
circuit assemblyisap:2941404840.632820
dielectric substrateisap:3348130270.632394
moduleisap:1607033580.628222
apparatusisap:3381374240.624329
packagingisap:3379784800.617661
multilayer print circuit boardisap:3734142690.608950
suitable substrateisap:3348130100.608298
objectisap:1652997600.608176
systemisap:1607771240.605524
flexible materialisap:2976786780.603440
high temperatureisap:2064769150.602163
surfaceisap:2281793000.601746
exampleisap:2222913140.600362
equipmentisap:3349913840.599588
supportisap:2296109050.595766
next level of packagingisap:3649082490.589689
surface of a substrateisap:2281793190.586395
fabricationisap:2089819110.583893
semiconductor packageisap:2301053360.578974
partisap:1956318580.576980
metalisap:3682006330.570297
connectorisap:3373517750.569525
electronic applicationisap:2074504010.561299
mannerisap:1614253890.557381
motherboardisap:2071839880.554952
electronic componentisap:3386278240.544621
electronic partisap:1956318720.534207
manufactureisap:2079337430.532488
present inventionisap:3358236350.526326
pieceisap:3758469870.524591
thin plateisap:3649071250.522186
elementisap:2305962390.519896
electronic structureisap:3373343230.517569
structureisap:3373343130.517516
electronicsisap:2081383540.515979
arrangementisap:2070461910.514206
typeisap:1952358250.508611
connectionisap:2596287330.508359
mediumisap:1643077990.505869
substrateisap:3348130020.505387
baseisap:1968767540.500178
assemblyisap:2941404700.499265
microprocessorisap:527853890.495285
likeisap:1959999170.493706
memberisap:1634909400.492154
panelisap:3766207390.491011
locationisap:2990262820.489036
other structureisap:3373343190.484456
workpieceisap:3346655840.482997
interfaceisap:3356227330.482586
housingisap:2308431590.481744
hardwareisap:2945199340.474832
surface of a workpieceisap:2281793530.462185
substrate 50isap:3348130800.461157
present embodimentisap:2588369660.459508
substrate 150isap:3348130660.455598
substrate 602isap:3348130550.454775
ground planeisap:3649078750.448508
accordinglyisap:2072194410.445951
articleisap:2281317090.441231
nisap:528696620.439406
traceisap:3760037990.434899
carrierisap:2218624810.419840
pair of guide tabisap:1956341980.397337
somethingisap:3358501170.378219
test pinisap:3242425050.377358
fig 1isap:3242788380.364245
commodityisap:3373080600.358552
plasticisap:2284250550.346256
surface of the packageisap:2281793740.335403
conductorisap:3392676870.318370
leadisap:1959897090.298608
chipisap:1967867480.279124
placeisap:3649095400.264776
patternisap:2259667880.257075
methodisap:1633495780.242283
useisap:3242356470.239276
inventionisap:3358236370.200428
heatisap:1959171990.193586
wasteisap:3676462900.185766
pluralityisap:3387039290.155622
test fixtureisap:2282382860.147000

Narrower concepts

labelprovenanceconfidence
mother boardisap:3734141290.827108
semiconductor packageisap:349589170.797153
print circuit boardisap:3734140600.779234
solder jointisap:3725832360.757133
motherboardisap:4138429680.716600
electrical componentisap:132537930.702166
circuit boardisap:3734140460.657492
flexible print circuit boardisap:3734141220.649458
integrate circuitisap:408263440.622075
multilayer print circuit boardisap:3734145970.613014
flip-chip attachmentisap:4760762890.609999
portionisap:374129220.602197
flip chip attachmentisap:4760762880.589389
electronic componentisap:132537920.574707
flat surfaceisap:345186270.561892
ground planeisap:3696038190.549333
backplaneisap:166851950.542931
transmission lineisap:931214940.537474
electrical connectorisap:127936600.521058
through-holeisap:677769020.519018
ceramic materialisap:3633221490.510666
boardisap:3734140710.488951
sensorisap:1197288440.471604
glassisap:3653343930.471579
supportisap:350880140.470173
contactisap:337957770.461407
capacitorisap:145991340.459749
interfaceisap:164256390.443914
color television setisap:4675697090.430791
plasticisap:373416870.430266
fig 1isap:4679650820.427056
transmission mediumisap:1136870570.423823
holeisap:946645910.411610
polyimideisap:168490790.401762
microprocessorisap:1318195230.397913
surfaceisap:345186240.393628
elementisap:383541160.392679
stepisap:898616890.387623
bumpisap:937485970.371740
regionisap:1213106190.369125
moduleisap:1159562910.367483
baseisap:892901560.361601
second substrateisap:133296700.357116
windingisap:406629960.355594
layerisap:3705607830.349518
memberisap:1200501210.348972
plateisap:3730851910.337356
bgaisap:4689117030.337329
sideisap:925629640.335835
ledisap:4676033480.329441
partisap:955699500.324599
componentisap:132537880.323924
simmisap:859332110.318038
deviceisap:1201436480.316745
method of manufacturingisap:1216293300.314814
circuitisap:408263560.314579
chassisisap:393027590.313610
traceisap:3688258740.312516
copperisap:1195828350.312296
busisap:4689940300.304004
systemisap:1201486570.301962
arrangementisap:4150302830.300896
switchisap:1230342940.291479
metalisap:3696852770.286613
apparatusisap:125400580.284563
prototypeisap:152979890.274411
meansisap:3652484750.272008
connectorisap:127936560.266429
wirebondingisap:4143202690.264404
laminateisap:3609326070.263730
methodisap:1216293290.258336
resultisap:1130604970.248369
housingisap:352441780.246326
fiberglassisap:4734856380.243159
connectionisap:4732195740.239507
connector assemblyisap:3615313920.239042
hardwareisap:3618083460.236941
socketisap:1151460560.236648
solderisap:1130321790.218678
sameisap:960150570.213187
substrateisap:133296520.204670
solderingisap:161161990.199498
objectisap:1228582430.189578
assemblyisap:3615313950.182687
productisap:388408280.175166
pcbisap:4695576700.165247
likeisap:883603560.150574
useisap:4655958540.137150