Premodifier: second
Head noun: substrate
| Same concepts |
|---|
Broader concepts
| label | provenance | confidence |
|---|---|---|
| second substrate | isap:353356777 | 0.792908 |
| circuit substrate | isap:353357506 | 0.700861 |
| first substrate | isap:353356915 | 0.695811 |
| semiconductor wafer | isap:15880889 | 0.607074 |
| liquid crystal display | isap:26976912 | 0.487836 |
| semiconductor | isap:507462325 | 0.455796 |
| substrate | isap:353356714 | 0.455052 |
| glass substrate | isap:353356704 | 0.415846 |
| film | isap:148525443 | 0.400506 |
| surface | isap:26400694 | 0.364934 |
| print circuit board | isap:13329670 | 0.357116 |
| method | isap:135529309 | 0.326018 |
| chip | isap:148728258 | 0.318981 |
| device | isap:132251118 | 0.270841 |
| polyimide | isap:353562311 | 0.224936 |
| bonding | isap:28835160 | 0.221536 |
| material | isap:410246775 | 0.212724 |
Narrower concepts
| label | provenance | confidence |
|---|---|---|
| second substrate | isap:353356777 | 0.792908 |
| substrate | isap:353356727 | 0.518933 |
| first substrate | isap:353356705 | 0.508980 |
| si | isap:97613087 | 0.399361 |
| portion | isap:317520683 | 0.376993 |
| bonding | isap:319578207 | 0.356730 |
| surface | isap:318206997 | 0.328180 |
| glass | isap:337149481 | 0.216053 |
| step | isap:288379114 | 0.209115 |
| pattern | isap:317284473 | 0.134670 |
| part | isap:290410578 | 0.058978 |