Premodifier: semiconductor
Head noun: wafer

Same concepts
http://dbpedia.org/resource/Wafer_(electronics)

Broader concepts

labelprovenanceconfidence
articleisap:2232937680.834863
semiconductor deviceisap:1584661530.812652
itemisap:1952115650.808825
deviceisap:1584661540.802669
componentisap:3397322020.798602
microelectronic substrateisap:3379631810.789102
substrate assemblyisap:2961655290.780405
semiconductor workpieceisap:3391651170.768282
fabrication processisap:2297944480.766069
type of substrateisap:1969221470.759891
semiconductor substrateisap:3379631710.757395
semiconductor componentisap:3397322070.752668
brittle materialisap:2935528690.747175
objectisap:1555759000.746686
semiconductor productisap:2302394130.746052
planar workpieceisap:3391651200.744677
electronic substrateisap:3379631850.744178
thin solid articleisap:2232937710.742109
silicon substrateisap:3379632380.734572
work pieceisap:3692446080.731063
electronic device substrateisap:3379632270.728771
electronic deviceisap:1584661560.718678
semiconductor waferisap:3743788890.718033
flat mediaisap:3734543120.717646
microelectronic workpieceisap:3391651140.715598
microelectronic deviceisap:1584661670.714012
disk-shaped workpieceisap:3391651210.710624
microelectronic elementisap:2286016670.709358
base materialisap:2935528550.707048
suitable substrateisap:3379631960.703640
thermal treatment of substrateisap:3381335470.690466
partisap:1958081760.690175
such substrateisap:3379632150.676951
flat workpieceisap:3391651160.673614
photosensitive substrateisap:3379631830.664069
substrateisap:3379631650.659836
applicationisap:2084350310.657854
wafer-shaped articleisap:2232937800.657173
substrate processing systemisap:1644806920.647789
surface of substrateisap:2236251290.640780
other materialisap:2935528620.636463
targetisap:1616030590.634291
substrate surfaceisap:2236251400.630890
materialisap:2935528410.613014
various substrateisap:3379632460.605242
sign inadvanced patent searchpatentsmethodisap:1638356860.605104
substrate 14isap:3379632060.605081
workpieceisap:3391651120.602472
thin diskisap:1955118570.597374
manipulation of multiple objectisap:4278355680.595783
glass substrateisap:3379633040.591686
semiconductor chipisap:1954735930.580647
productisap:2302394110.570654
plasma processing apparatusisap:3356473470.567828
structureisap:3367939570.565901
sampleisap:1637033730.565777
surface of objectisap:2236251430.565590
other substrateisap:3379632680.542957
waferisap:3743788860.537041
integrate circuitisap:2312056000.530280
uspto assignmentisap:2579871900.528407
elementisap:2286016650.525326
processing of waferisap:2587914860.521331
present inventionisap:3389869440.515038
substrate 2isap:3379632350.510642
fig 1isap:3264399870.501138
variety of substrateisap:2288239990.500800
oxide layerisap:3692605820.493718
polished workpieceisap:3391651360.490801
surface of a substrateisap:2236251200.489777
cleaningisap:2962245040.478039
substanceisap:3394932490.477922
stepisap:1970207750.469709
improved methodisap:1536355370.467528
circuitisap:2312055980.460856
slice of semiconductor materialisap:3662131370.451573
disk-shaped substrateisap:3379632960.451474
wafer-shaped objectisap:1555759050.445941
surface of a workpieceisap:2236251230.437287
cmp processisap:2297944490.435860
surface of a objectisap:2236251220.433985
surfaceisap:2236251210.432366
specimenisap:2954777900.410053
embodimentisap:2596964600.407692
containerisap:3391388060.407176
polishedisap:2959013310.365413
cmpisap:3264682110.364380
coatingisap:2259654930.364284
likeisap:1961772260.356798
layerisap:3692605720.352332
methodisap:1536355290.350920
processisap:2297944470.330729
semiconductorisap:965977860.321848
exampleisap:2262547430.310841
howeverisap:2309512800.306612
treatmentisap:3381335460.294891
defectisap:1585744440.293690
resultisap:1534457600.287896
particleisap:2971875100.284725
apparatusisap:3356473400.276237
systemisap:1644806900.272554
problemisap:2297324490.261794
inspectionisap:2609424130.246725
numberisap:1614567950.224121
sample 1isap:1637033830.201890
machineisap:2280294660.200795
inventionisap:3389869470.191818
useisap:3264083710.186090

Narrower concepts

labelprovenanceconfidence
gallium arsenide waferisap:3743788900.795248
gallium arsenideisap:3602845400.725663
semiconductor waferisap:3743788890.718033
chemical vapor depositionisap:4755234850.713217
integrate circuitisap:327325060.695009
silicon waferisap:3743788840.673140
preferred embodimentisap:4748594740.665072
glass substrateisap:158808860.647195
first substrateisap:158808750.608176
second substrateisap:158808890.607074
siliconisap:381431580.574177
adhesive filmisap:889010930.537869
wafer 21isap:3743789630.505244
silicon substrateisap:158809300.496187
substrate 10isap:158809210.466955
waferisap:3743788870.440001
icisap:4640723850.434329
microprocessorisap:1312058500.403395
transistorisap:4743469970.398404
gaaisap:4697887770.393036
fig 1isap:4699596910.392459
circuitisap:327325080.383230
waterisap:3712857370.374526
microchipisap:150455480.373984
exampleisap:374830730.368774
siisap:4640383130.355023
surface of the waferisap:352913170.350141
arrayisap:3672241240.332503
surfaceisap:352913140.328885
particleisap:3634609720.318048
structureisap:142656000.317033
reticleisap:369891510.298724
likeisap:894895930.283663
mmisap:4639090140.274620
materialisap:3637646560.262574
pluralityisap:148253750.254995
fig 3isap:4699596960.235951
substrateisap:158808520.233065
filmisap:889010920.220451
deviceisap:1219222570.200617
workpieceisap:173245760.186255
laserisap:3655462190.184470
lcdisap:4656476820.181118
caseisap:962078290.172807
carrierisap:404224240.164876
etchingisap:344600540.161778
methodisap:1188261370.153267
nitrogenisap:3631564180.135929
inventionisap:140256480.128722
apparatusisap:147667620.106385