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About:
solder
Head noun: solder
Same concepts
http://dbpedia.org/resource/Solder
Broader concepts
label
provenance
confidence
suitable conductive material
isap:
104273895
0.668961
conductive material
isap:
104273886
0.652844
electrical connection
isap:
19539924
0.650555
low melting point metal
isap:
123626381
0.643675
material
isap:
104273885
0.570652
metal alloy
isap:
115614377
0.534404
conventional means
isap:
123875007
0.494199
brazing material
isap:
104273891
0.491765
fusible material
isap:
104273889
0.488469
alloy
isap:
115614378
0.480412
conductive structure
isap:
422967392
0.478321
conventional method
isap:
387012961
0.465823
conductive bonding material
isap:
104273890
0.463220
factor
isap:
385407743
0.456232
adhesive material
isap:
104273893
0.454295
suitable bonding material
isap:
104273908
0.447863
suitable solder
isap:
397540657
0.439433
part
isap:
489523670
0.438428
metallic bonding material
isap:
104273901
0.436600
lead-free component
isap:
424981570
0.427847
other method
isap:
387012960
0.425116
attachment mechanism
isap:
421781188
0.422381
fusible conductive material
isap:
104273902
0.420329
solder composition
isap:
450653083
0.420102
soft material
isap:
104273897
0.418075
suitable type
isap:
489946841
0.413358
tool
isap:
489926205
0.411353
other material
isap:
104273892
0.411001
solderable material
isap:
104273940
0.403284
suitable means
isap:
123875006
0.402524
many material
isap:
104273951
0.397838
suitable material
isap:
104273888
0.396903
metallic composition
isap:
450653082
0.394465
conductive compound
isap:
105174648
0.392165
standard material
isap:
104273910
0.391754
bonding agent
isap:
116323051
0.390269
metal product
isap:
447381667
0.389957
adhesion material
isap:
104273936
0.388985
bonding process
isap:
448305764
0.382639
eutectic material
isap:
104273961
0.381432
eutectic metal
isap:
123626392
0.381154
means
isap:
123875005
0.380630
conductive metal
isap:
123626380
0.379962
conductive adhesive
isap:
104642963
0.377227
conductive bond
isap:
491802199
0.373794
bondable material
isap:
104273898
0.372311
electrode
isap:
422477617
0.368256
viscous material
isap:
104273904
0.366884
bonding material
isap:
104273887
0.361945
consumable
isap:
18386253
0.361727
suitable technique
isap:
420568919
0.358639
product
isap:
447381669
0.358119
substance
isap:
425559885
0.356140
conductive element
isap:
441815699
0.353356
soldering material
isap:
104273966
0.352184
mechanical fastener
isap:
100434692
0.351130
possibility
isap:
452307424
0.345029
suitable metal
isap:
123626388
0.343349
conductor
isap:
421209896
0.340494
alloy of metal
isap:
115614385
0.339903
conductive medium
isap:
389039837
0.339219
equipment
isap:
422995640
0.338123
such material
isap:
104273907
0.337054
solder paste
isap:
117003185
0.335025
low-melting-point alloy
isap:
115614386
0.332060
lead
isap:
491011564
0.330199
gold alloy
isap:
115614392
0.318356
metal
isap:
123626379
0.317470
adhesion step
isap:
490053865
0.317090
conductive particle
isap:
104408675
0.311552
project
isap:
447796967
0.304745
technique
isap:
420568918
0.301397
conductive elevation
isap:
422924941
0.301289
attachment
isap:
20803413
0.296780
process
isap:
448305762
0.293824
adhesive
isap:
104642962
0.285603
manner
isap:
388630351
0.283908
metallic material
isap:
104273899
0.278262
coating
isap:
449609900
0.273146
supplies
isap:
104254772
0.271610
solder
isap:
397540635
0.266640
use
isap:
405043878
0.261244
feature
isap:
443139289
0.259040
most solder
isap:
397540643
0.258238
combination of material
isap:
451066754
0.257890
method
isap:
387012959
0.256917
surface of the base
isap:
445750217
0.253361
item
isap:
490758348
0.252691
technology
isap:
20822305
0.251951
single metal
isap:
123626383
0.251559
tin-lead alloy
isap:
115614379
0.251424
portion
isap:
448698045
0.248441
present invention
isap:
422832319
0.244012
low temperature material
isap:
104273934
0.243240
connection
isap:
19539923
0.243015
contaminant
isap:
451723442
0.238307
people
isap:
391881846
0.237547
useful tool
isap:
489926206
0.236481
soldering
isap:
421513765
0.234022
choice for project
isap:
386001074
0.232870
filler metal
isap:
123626389
0.232799
art
isap:
405096175
0.231894
solder joint
isap:
116564691
0.228759
substrate
isap:
424017338
0.224849
alloy include tin
isap:
115614389
0.224437
intermediate layer
isap:
120635185
0.224267
thing
isap:
116941818
0.222953
binder
isap:
387786547
0.222545
print circuit board
isap:
113032179
0.218678
lead-free solder
isap:
397540647
0.218379
mixture of metal
isap:
445243692
0.218321
form
isap:
490418035
0.217385
wire
isap:
488853256
0.217331
type of solder
isap:
489946840
0.214792
tin
isap:
405064686
0.210469
soft solder
isap:
397540651
0.209300
element
isap:
441815700
0.206865
connector
isap:
425125415
0.206115
agent
isap:
116323052
0.203033
pcb
isap:
405075770
0.202451
die
isap:
405098231
0.200133
breeze
isap:
394386405
0.199981
system
isap:
385548341
0.199485
or
isap:
513868574
0.198945
compound
isap:
105174649
0.198627
mixture
isap:
445243694
0.198396
common method
isap:
387012964
0.198336
waste
isap:
122362215
0.194681
offensive line
isap:
489470551
0.193297
structure
isap:
422967393
0.191515
composition
isap:
450653080
0.190578
type
isap:
489946838
0.189479
everything
isap:
19768624
0.189087
mistake
isap:
441489834
0.187824
tungsten
isap:
104978925
0.187082
defect
isap:
390387893
0.182724
bonding layer
isap:
120635188
0.181269
respectively
isap:
68907113
0.180328
component
isap:
424981564
0.179470
pad
isap:
405075134
0.173972
shape
isap:
114251240
0.172397
gold
isap:
490536871
0.172316
pain
isap:
489523258
0.171506
machine
isap:
440586350
0.171204
materials
isap:
424964777
0.170230
other
isap:
115805359
0.168622
alloy of lead
isap:
115614380
0.167618
player
isap:
396522290
0.163610
silver
isap:
393593885
0.163247
paste
isap:
117003186
0.161983
resin
isap:
121865924
0.159521
temperature
isap:
450665679
0.157883
socket
isap:
396695031
0.157498
formed
isap:
385692487
0.157133
area
isap:
491716033
0.153360
reach
isap:
121812851
0.152832
copper
isap:
395359253
0.150310
palladium
isap:
419865142
0.146642
however
isap:
445119287
0.146411
bonding
isap:
446526846
0.146381
combination
isap:
451066752
0.146122
furthermore
isap:
452726364
0.139110
attached
isap:
104493757
0.138808
layer
isap:
120635184
0.138699
bump
isap:
491820792
0.138036
also
isap:
491680296
0.134353
liquid
isap:
393978106
0.132292
problem
isap:
448159659
0.130979
example
isap:
449004658
0.129596
guy
isap:
405092875
0.128004
fit
isap:
405089595
0.125553
nickel
isap:
386878825
0.124250
first
isap:
116582051
0.121947
soldering iron
isap:
490760288
0.119349
alternatively
isap:
22167329
0.113716
joint
isap:
116564692
0.110704
medium
isap:
389039836
0.102623
heating
isap:
448987725
0.095017
board
isap:
113032180
0.094444
everyone
isap:
100541553
0.092404
nothing
isap:
442100315
0.091656
stress
isap:
386563793
0.090998
additionally
isap:
68760991
0.089399
line
isap:
489470552
0.089092
issue
isap:
113221284
0.088017
link
isap:
489470408
0.084016
place
isap:
120837440
0.081367
kit
isap:
405084045
0.070386
hole
isap:
490639515
0.068329
number
isap:
389730336
0.066820
splice
isap:
385751979
0.044034
Narrower concepts
label
provenance
confidence
eutectic tin-lead solder
isap:
397540639
0.616072
silver solder
isap:
397540641
0.615291
lead-tin solder
isap:
397540638
0.549870
solder ball
isap:
305800384
0.542774
lead-free solder
isap:
397540653
0.535730
eutectic solder
isap:
397540637
0.513711
pb/5 sn
isap:
107982698
0.395938
lead pb
isap:
108835078
0.385006
conductive epoxy
isap:
154507962
0.341607
bonding material
isap:
484771557
0.318667
epoxy resin
isap:
157291365
0.318340
indium
isap:
395764269
0.270583
solder
isap:
397540635
0.266640
gold
isap:
305853802
0.249127
copper
isap:
389607317
0.244719
snpb
isap:
307694801
0.238579
sign inadvanced patent
isap:
393894184
0.233263
circuit board
isap:
156465979
0.227738
metal alloy
isap:
157680123
0.226351
tin
isap:
211583509
0.220254
pbsn
isap:
305203146
0.213933
silicon
isap:
275321995
0.211141
gold-tin
isap:
485543886
0.206586
adhesive
isap:
478757318
0.202372
result
isap:
386894056
0.201051
sn
isap:
107982697
0.197413
lead
isap:
305009300
0.196834
pb
isap:
108835079
0.194117
unit
isap:
302810960
0.170964
flux
isap:
310604671
0.169671
au/sn
isap:
156208211
0.166640
chip
isap:
300898869
0.166176
moment
isap:
387546347
0.164142
metal
isap:
156923529
0.162567
everything
isap:
257138067
0.159534
epoxy
isap:
154507961
0.156062
silver
isap:
394514434
0.154123
point
isap:
157361884
0.153184
material
isap:
484771555
0.150480
ausn
isap:
311032931
0.149915
hole
isap:
306743056
0.132472
project
isap:
270273332
0.130358
free
isap:
306915304
0.127832
nickel
isap:
385317419
0.122172
hardware
isap:
482302133
0.112154
au
isap:
107579344
0.107970
resin
isap:
157291364
0.089683
like
isap:
304858079
0.087990
lead-free
isap:
135146606
0.087802
diode
isap:
157113057
0.083362
component
isap:
136810863
0.082671
means
isap:
163508051
0.082511
fact
isap:
305408720
0.075304
joint
isap:
164799184
0.071706
issue
isap:
157190621
0.071639
surface
isap:
269037666
0.059289