About: bond pad

Premodifier: bond
Head noun: pad

Same concepts

Broader concepts

label	provenance	confidence
electrical connection	isap:237675321	0.694345
conductive terminal	isap:331301904	0.688737
contact location	isap:332304432	0.676734
surface of the die	isap:232268843	0.625123
feature	isap:234069823	0.587168
metal layer	isap:467629988	0.572784
structure	isap:261585426	0.570248
plurality of semiconductor dice	isap:261930477	0.566658
pad	isap:280853622	0.555705
component	isap:262674512	0.535391
metallization	isap:278386955	0.508010
conductive element	isap:232996031	0.497307
contact	isap:232937824	0.455908
terminal	isap:331301902	0.451877
conductor	isap:263327391	0.432524
area	isap:249019678	0.413666
semiconductor	isap:278511289	0.398343
trace	isap:470565474	0.395122
substrate	isap:263392624	0.392310
test pad	isap:280853635	0.367233
element	isap:232996030	0.274081

Narrower concepts

label	provenance	confidence
semiconductor device	isap:405588610	0.663881
embodiment	isap:401365750	0.204421
example	isap:508072143	0.113746