About: bonding pad

Premodifier: bonding
Head noun: pad

Same concepts
http://dbpedia.org/resource/Wire_bonding

Broader concepts

label	provenance	confidence
wire bonding pad	isap:280853701	0.717016
conductive layer	isap:467629985	0.669545
second element	isap:232996066	0.599186
control circuit	isap:237001590	0.588643
bonding pad	isap:280853662	0.556949
semiconductor device	isap:215117741	0.514767
feature	isap:234069832	0.479333
surface of the semiconductor	isap:232268812	0.459383
structure	isap:261585433	0.431998
problem	isap:231786300	0.379649
test pad	isap:280853617	0.277266

Narrower concepts

label	provenance	confidence
ultrasonic bonding	isap:508472439	0.768768
bonding pad	isap:280853662	0.556949
semiconductor	isap:240780383	0.370369
pattern	isap:509282583	0.288859